STATS ChipPAC

STATS ChipPAC: the world’s 4th largest Outsourced Semiconductor Assembly and Test player announced that it has successfully designed and implemented a new manufacturing method FlexLine for its waferlevel packaging services. According to the mgt , FlexLine is able to deliver unmatched flexibility (regardless of wafer diameters, be it 200mm, 300mm, or 450mm) and cost reduction (15-30% cost reduction as compared to conventional wafer-level packaging). As the worldwide demand for semiconductor packaging services continue to shift from conventional packaging (wire-bonding) to advanced level packing (wafer-level packaging) driven by miniaturisation of electronic devices, OSK-DMG opines that STATS' strategy to focus on developing high-tech solution will eventually bear fruit. Stock is +6.5% at $0.33