Stats Chippac

Stats Chippac: Counter is up 3% today, with the positive news flow continuing on. STATS ChipPAC and UMC Unveil World’s First 3D IC Developed under an Open Ecosystem Model. Stats and UMC, a leading global semiconductor foundry, today announced the world’s first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration. The 3D chip stack, consisting of a Wide I/O memory test chip stacked upon a TSV-embedded 28nm processor test chip, successfully reached a major milestone on package-level reliability assessment. This success demonstrates a total solution for reliable 3D IC manufacturing through the combination of UMC’s foundry and STATS ChipPAC’s packaging services. We like to highlight that newsflows regarding Stats Chippac has been pretty positive over the last few wks. Earlier this mth, Stats raised its 4Q12 sales guidance by between 9-14% on the back of better than expected demand from smart-phones and tablet computers. Capex budget was also raised between 20-40%. With its continued increase in capex spending, and proven R&D capabilities, the Company is in a good position within the Tech space.