Stats Chippac

Stats Chippac: Positive newsflow continues, as grp announced that it has signed adefinitive patent license, settlement agreement with Tessera; results in dismissal of all claims, counterclaims between Tessera Inc, STATS ChipPAC and subsidiaries. This effectively ends all outstanding litigation between parties & Provides STATS ChipPAC and subsidiaries with 5-yr license to Tessera’s complete patent portfolio for semi packaging tech We like to highlight that newsflows regarding Stats Chippac has been pretty positive over the last few wks. See our recent repost below as well: Positive news flow continues for Stats, Spreadtrum Communications (SC), a semiconductor provider in China for smart-phones, and other consumer electronic products that support 2G, 3G and 4G wireless communication standards, has adopted STATS’ next generation Embedded Wafer Level Ball Grid Array (eWLB) packaging technology. SC said that STATS’ eWLB allows their products to have better performance, a more compact form factor and is also competitively priced. The latest contract win demonstrate STATS’s capabilities in commercializing its cutting-edge wafer level packaging solution, helping Spreadtrum to offer increased performance and compact form factor at a competitive cost for the fast-growing China smartphone market. Recall few days back TSMC, the world’largest foundry (metal castings) and a key customer of STATS reported 4Q12 sales, +25% yoy to NT$131b, beating expectations and also guided for 1Q 13 sales of NT$127-129b also beating expectations of NT$124b.Grp's founder and Chairman add that the co will be increasing their capex plans for 2013 by 13% due to stronger than expected demand for smart-phone and tablet computers. Earlier this mth, STATS too raised its 4Q12 sales guidance by between 9-14% on the back of better than expected demand from smart-phones and tablet computers. Capex budget was also raised between 20-40%.